Micro-electromechanical systems (MEMS) processing technology is a micron or sub-micron level fine processing technology that uses small machines to make micro machines after making small machines from large machines. MEMS are miniature devices or systems that can be fabricated in bulk, combining micro mechanisms, micro sensors, micro actuators and signal processing and control circuits, up to interfaces, communications and power supplies.
There are many materials available for MEMS processing technology, from polysilicon to stainless steel precious metals, from ceramics to glass, all can be prepared into micro-needles with MEMS processing technology. The current processing technology can fully meet the precision requirements of the microneedle, and the length and form of the needle body is controlled by a computer program throughout the production process, and good repeatability ensures the uniformity of the microneedle.
MEMS device design is mainly based on MEMS three-dimensional structure as the research object, structural mechanics analysis, electrical model analysis, coupling field analysis and behavior analysis and other research. MEMS design requires system modeling, simulation, design optimization and process simulation. The design tool research mainly focuses on the development of computer-aided design (CAD) tools for simulation, analysis and evaluation of a certain part of the MEMS device design process or process.
The substrate materials used to develop MEMS can be silicon materials such as monocrystalline silicon, polysilicon, silicon oxide, etc., and polymer materials such as silicone rubber, poly (parylene), polyimide, etc.
Advanced MEMS functional materials can improve the performance of MEMS devices and systems with energy conversion capabilities, enabling sensitive and actuating functions. Carbon nanotube composites, metal matrix composites, metal oxide nanocomposites, etc. can be selected.
Silicon-based micromachining technology uses chemical etching or integrated circuit process technology to process silicon materials to form silicon-based MEMS devices.
Using traditional machining methods, small machines are made from large machines, and then small machines are used to make micromachines.
This method can be classified as ultra-precision machining. This processing method can be divided into two categories: ultra-precision mechanical processing and special microfabrication.
After making plates with synchrotron X-ray masks and deep lithography, micro electroforming is performed to create micro replication molds, which are used for micro replication process and secondary micro electroforming, and then micro injection molding technology is used for mass production of micro devices.
The mechanical properties of microneedles such as elastic modulus, fracture strength, and micro-friction characteristics are important data for the design of MEMS devices, and the mechanical properties of MEMS materials are mainly tested by micro-Raman spectroscopy and tensile testing. The measurement of microneedle geometry and surface topography is also the basis of MEMS measurement. Two-dimensional micro-geometry size inspection usually uses observation instruments such as atomic force microscope (AFM), scanning electron microscope (SEM).
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